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Responsibilities Responsible for wafer dicing and pick & place as well as the associated equipment
Development and optimization of new or existing processes
Identification, analysis and elimination of process problems
Specification, evaluation, installation and qualification of new systems and equipment
Ensure 2nd level support for equipment and process problems in production
Your Profile Completed engineering studies (microtechnology, electrical engineering, mechanical engineering, physics or in a comparable field)
Several years of professional experience in the manufacturing industry in a similar position
Proven expertise in MEMS manufacturing technologies and/or semiconductor production
Good knowledge of German and English required
High level of initiative and doer mentality
What You Can Expect Exciting job in a market leading, international company in the canton of Obwalden
Collegial and helpful interaction, Du culture
Versatile tasks in an innovative and dynamic technology environment
Attractive further training opportunities
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